Non-electrolytic silver plating
Compatible with next-generation SiC power devices! Achieves excellent performance.
"Electroless Ag plating" is a technology from OJIC Technologies designed for next-generation SiC power devices. Conventional technologies faced issues such as instability in operation under high-temperature environments and an inability to meet the demands for higher performance devices, necessitating more advanced processing to accommodate SiC power devices. Our "Electroless Ag plating" can solve the challenges of conventional technologies by enabling operation in high-temperature environments through high melting point metal bonding with Ag nanoparticles. 【Features】 ■ Achieves excellent performance as an alternative plating to Au, such as DIG (Direct Immersion Gold) ■ Maintains quality for a long period without being affected by the substrate (such as Cu) and without oxidation ■ Supports fine wiring patterns and partial plating by forming a uniform thin film (0.1~0.5μmt) *For more details, please refer to the PDF document or feel free to contact us.
- 企業：オジックテクノロジーズ
- 価格：Other
